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High-Frequency Jet Impingement Liquid Cooling Plate Also Commonly Referred
Λεπτομέρειες:
| Τόπος καταγωγής: | Dongguan, Γκουανγκντόνγκ, Κίνα |
| Μάρκα: | Uchi |
| Πιστοποίηση: | SMC |
| Αριθμό μοντέλου: | Ψύκτρα |
Πληρωμής & Αποστολής Όροι:
| Ποσότητα παραγγελίας min: | 100 τεμ |
|---|---|
| Τιμή: | 1300-1500 dollars |
| Χρόνος παράδοσης: | Μη περιορισμένος |
| Όροι πληρωμής: | T/T, paypal, Western Union, MoneyGram |
| Δυνατότητα προσφοράς: | 50000000 τμχ ανά μήνα |
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Λεπτομερής ενημέρωση |
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| Εφαρμογή: | Ηλεκτρονική ψύξη, βιομηχανικά μηχανήματα, αυτοκίνητα | Μέγεθος: | 280x220x20mm |
|---|---|---|---|
| Κατηγορία Προστασίας: | IP54 | Επιπρόσθετη διαδικασία: | Cnc μηχανική κατεργασία |
| Ισχύς Πηγής Θερμότητας: | 30 KW | Εξουσία: | 400W |
| Διάσταση προϊόντος: | μπορεί να προσαρμοστεί | Κράμα ή όχι: | Είναι κράμα |
| Τραχύτητα επιφάνειας: | 1,2 μ.μ. | συσκευασία: | ΠΕ σακούλα |
| Υλικό: | Χαλκός / Αλουμίνιο | ||
| Επισημαίνω: | high-frequency jet impingement liquid cooling plate,liquid cooling plate with jet impingement,high-performance liquid cooling plate |
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Περιγραφή προϊόντων
High-Frequency Jet Impingement Liquid Cooling Plate
High-Frequency Jet Impingement Liquid Cooling Plate (also commonly referred to as Jet Impingement Cold Plate) is a special liquid cooling solution for ultra-high heat flux and ultra-fast temperature uniformity. Its core mechanism is to achieve extreme heat dissipation by directly impinging the inner wall of the heating surface with high-frequency, high-speed, and high-pressure micro-jets.
I. Core Principle (Essential Difference from Traditional Flow Channels)
Traditional Liquid Cooling Plate:
Coolant flows in parallel within enclosed channels for heat exchange, featuring thick thermal boundary layer, high thermal resistance, and prone to hot spots at distant positions.
High-Frequency Jet Impingement Type:
- Coolant passes through a dense array of micro-nozzles (diameter 0.1–1 mm)
- Impinges vertically at high speed onto the inner wall of the cold plate (heating surface)
- Instantly breaks the thermal boundary layer, increasing local heat transfer coefficient by 5–10 times
- Fluid diffuses rapidly and drains laterally, achieving extremely uniform temperature across the whole area (temperature difference < ±1℃)
II. Typical Structure
- Upper Chamber (Distribution Chamber): stabilizes pressure and distributes coolant evenly to nozzles
- Nozzle Plate: core component with hundreds to thousands of precision micro-holes (high-frequency jet array)
- Impingement Chamber (Heat Exchange Zone): jet impingement and intensive convective heat transfer
- Liquid Collection Chamber / Drainage Channel: quickly discharges the heat-absorbed coolant
III. Key Technical Features
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Extremely High Heat Dissipation CapacityHeat flux density: 200–1000 W/cm² (ordinary brazed plate approx. 50 W/cm²)Thermal resistance as low as 0.01–0.03 ℃/W
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Excellent Temperature UniformityFull-surface temperature difference: ±0.5–±1℃Completely eliminates local hotspots
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Fast Response SpeedLow thermal inertia, precise temperature control, suitable for transient high-power and pulse heating scenarios
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Relatively High Pressure DropRequires matching high-pressure pump / high-flow cooling system
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High Manufacturing Precision RequirementsNozzle hole diameter, depth, and position tolerance: ±0.02–±0.05 mm
IV. Main Manufacturing Processes
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Precision Drilling + Vacuum BrazingSuitable for circular hole arrays with stable mass productionCommon materials: aluminum alloy / copper alloy, brazed sealing
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Photolithography / Etching + Diffusion BondingSuitable for special-shaped nozzles and micro-scale slot jetsFiner flow channels and lower thermal resistance (for AI/GPU/laser applications)
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3D Printing (SLM)Integrated forming with complex topological channels + nozzlesLightweight design, suitable for customized aerospace components
V. Application Scenarios (Extreme Thermal Management)
- AI / Supercomputing Chips: H100/H200, GPU clusters, TPUs (>500W chips)
- SiC / GaN Power Modules: 800V electric drives, ultra-fast charging stations
- High-Power Lasers: fiber / semiconductor / UV lasers (heat flux > 300W/cm²)
- Radar / Phased Array: military T/R components, 5G/6G base stations
- Medical Imaging: MRI gradient amplifiers, CT detectors (temperature control accuracy ±0.5℃)
- Aerospace: satellite payloads, missile guidance (vibration-resistant, lightweight, high heat flux)
VI. Comparison with Conventional Liquid Cooling Plates
| Performance | Conventional Flow Channel Liquid Cooling Plate | High-Frequency Jet Impingement Liquid Cooling Plate |
|---|---|---|
| Heat Flux Density | < 50 W/cm² | 200–1000 W/cm² |
| Thermal Resistance | 0.1–0.5 ℃/W | 0.01–0.03 ℃/W |
| Temperature Uniformity | Temperature difference 3–10℃ | Temperature difference < ±1℃ |
| Pressure Drop | Low (0.5–2 bar) | High (2–8 bar) |
| Application Scenarios | Conventional power devices | Ultra-high heat flux, hotspot-sensitive, high-precision temperature control |
VII. Summary
High-Frequency Jet Impingement Liquid Cooling Plate represents the state-of-the-art liquid cooling technology in modern industry, designed specifically for extreme heat flux, ultimate temperature uniformity, and high-precision temperature control.
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